buildbot
Well-known member
No idea, Sony doesn’t share what process their sensors are made on. Could be 90, which is very old, or 65 which is also old, or even 45? I really don’t know. The pixel size is still 2 orders of magnitude bigger than 90nm.So which Nanometer mask would apply for a modded 811?
So CPU wise you are saying we are stuck with the same old system?
Super frustrating that we are facing the prospect of 3:2. It’s horrible. I have gotten so accustomed to 54x40.
Masks are not the only part, packaging, testing, all need to be redone slightly per design. Semiconductor manufacturing is a giant pain. At my (not my team though directly) they literally built a Robotic system totally bespoke to test each die coming out of TSMC:
Sony will have something like this for image sensors. They might need to change it for a larger one, or not. The point is that it’s very very expensive to customize a design even slightly.
Also, semiconductor design times are much longer than people realize. The choice of 3:2 was probably decided 4 years ago if not longer roadmap wise. Final specs 2 years possibly. (These are all ballpark guesses!) If you have ever built your own computer, you’ll see a copyright date typically on the cpu. It’s typically years before that CPU is marketed!
Maybe, they could change the platform again to use something like the Versal line which is 7nm, but it might not support the slvs-ec protocol that sony uses in their larger sensors (the zync is one of the very rare devices that explicitly does!).
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